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Prof. Dr.-Ing. Joachim N. Burghartz


Guide to State-of-the-Art Electron Devices

Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications

Guide to State-of-the-Art Electron Devices marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field.
•Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society
•Contributed by internationally respected members of the electron devices community
•A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms
•Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered

IEEE`s "Guide to State-of-the-Art Electron Devices" published by Prof. Dr. Joachim Burghartz was awarded the PROSE Award 2013 on February 6th, 2014 in the Engineering & Technology category.

For further information on the PROSE Award, please go to http://proseawards.com
Addition information on the book can be found at http://www.wiley-vch.de

Ultra-thin Chip Technology and Applications

Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.