FFLexCom - High Frequency Flexible Bendable Electronics for Wireless Communication Systems
The Priority Programme “High Frequency Flexible Bendable Electronics for Wireless Communication Systems” (FFlexCom, SPP 1796) has been established by the Senate of the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation). The programme started in 2015 and is planned to run for six years.
Institute of Nano- and Microelectronic Systems as a member of FFLexCom group is working in collaboration with two other research institutes. In this work, Institute of Electrical and Optical Communications Engineering (INT) is designing the silicon chips, Institute of Radio Frequency Technology (IHF) is simulating the antenna, and Institute of Nano- and Microelectronic Systems (INES) is fabricating the flexible hybrid system including the antenna and the silicon chip in the polymer foil.